Reunioncrystalline Diamond Powder NRS60A

1.01.00003

Characteristics

It is a synthetic modified grinding powder, which is with multi-blade structure and nice self-sharpening performance. In lapping and polishing applications, its characteristics enable to take both high grinding rates and significant removal rates, so that make a high-quality surface finish.

Available Size

20μm-50μm

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Applications

◆ Semiconductor wafer processing: mainly including sapphire substrate, silicon carbide substrate, sapphire window, silicon carbide, gallium nitride, etc.

◆ Ceramic material processing: zirconia fingerprint recognition chip, zirconia ceramic mobile phone back shell and other functional ceramics.

◆ Metal material processing: stainless steel, die steel, titanium alloy and other metal materials.

◆ Grinding liquid and pads: cooperate with diamond suspension & slurry or diamond pads manufacture.

Part of Specifications

Precision size range

Order NumberGrit size
micron
Median(D50)
micron
Median tolerance
micron
Upper limit(D99)
micron
1.01.000036.03020-50≤160





















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