◆ Semiconductor processing: silicon wafers, germanium, gallium arsenide, indium phosphide, silicon carbide, gallium nitride and other semiconductor materials.

◆ Sapphire processing: sapphire substrates, LED chips, optics lens, watch or clock galss, mobile phone fingerprint recognition films, etc.

◆ Ceramic and Metal processing: ceramic materials such as zirconia ceramic special-shaped parts, aluminum nitride substrates, mobile phone ceramic covers, watch ceramic structural parts, stainless steel, aluminum parts, copper parts, mold steel, mobile phone backplane, and other super hard alloy metal materials.

◆ Grinding liquid and pads: cooperate with diamond suspension & slurry or diamond pads manufacture.