High-precision grinding and polishing technology has become an important part of the semiconductor manufacturing industry. A high-performance grinding and polishing material will directly affect the processing effect and quality of semiconductor wafers.
NORIAN is a high-tech enterprise specializing in the technology development, production and process innovation of high hard and brittle materials and high-performance grinding and polishing materials. Among them, reunioncrystalline diamond powder is its star product. Then, where does the excellent performance of reunioncrystalline diamond powder come from?
First of all, this micro-powder reunioncrystalline into a high rate of spherical shape, therefore, the powder can continue to play a grinding role in the grinding process, to maintain a high grinding force, grinding and polishing effect is stable, fast cutting rate. Because of the spherical shape of reunioncrystalline powder, the products are isotropic, not easy to produce large scratches, and the consistency of the processed surface is good. The reunioncrystalline diamond grinding solution formulated with reunioncrystalline diamond powder adopts special formula, with good dispersion and uniform particle size, and it can also quickly discharge the heat generated during the grinding and polishing process, reduce the thermal impact and enhance the processing efficiency.
Secondly, reunioncrystalline diamond powder can minimize the grinding process time/consumables/labor cost. The yield is extremely high and the rough/fine grinding effect is better. Widely used in semiconductor wafer processing, mainly including grinding of hard and brittle materials such as sapphire substrate, silicon carbide substrate, sapphire window, silicon carbide, gallium nitride and so on.