It is similar to the polycrystalline's feature. Its particle surface has a lot of sharp cutting edges with small cutting edges and low hardness, so it has strong cutting force and high polishing precision. Due to its rough surface, which can be firmly combined with the binder, to improve the holding force of the diamond abrasive products, its service life is longer.
◆ Semiconductor processing: silicon wafers, germanium, gallium arsenide, indium phosphide, silicon carbide, gallium nitride and other semiconductor materials.
◆ Sapphire processing: sapphire substrates, LED chips, optics lens, watch or clock galss, mobile phone fingerprint recognition films, etc.
◆ Ceramic and Metal processing: ceramic materials such as zirconia ceramic special-shaped parts, aluminum nitride substrates, mobile phone ceramic covers, watch ceramic structural parts, stainless steel, aluminum parts, copper parts, mold steel, mobile phone backplane, and other super hard alloy metal materials.
◆ Grinding liquid and pads: cooperate with diamond suspension & slurry or diamond pads manufacture.
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