It is a synthetic modified grinding powder, which is with multi-blade structure and nice self-sharpening performance. In lapping and polishing applications, its characteristics enable to take both high grinding rates and significant removal rates, so that make a high-quality surface finish.
◆ Semiconductor wafer processing: mainly including sapphire substrate, silicon carbide substrate, sapphire window, silicon carbide, gallium nitride, etc.
◆ Ceramic material processing: zirconia fingerprint recognition chip, zirconia ceramic mobile phone back shell and other functional ceramics.
◆ Metal material processing: stainless steel, die steel, titanium alloy and other metal materials.
◆ Grinding liquid and pads: cooperate with diamond suspension & slurry or diamond pads manufacture.
|Order Number||Grit size|