1.01.00003
It is a synthetic modified grinding powder, which is with multi-blade structure and nice self-sharpening performance. In lapping and polishing applications, its characteristics enable to take both high grinding rates and significant removal rates, so that make a high-quality surface finish.
20μm-50μm
◆ Semiconductor wafer processing: mainly including sapphire substrate, silicon carbide substrate, sapphire window, silicon carbide, gallium nitride, etc.
◆ Ceramic material processing: zirconia fingerprint recognition chip, zirconia ceramic mobile phone back shell and other functional ceramics.
◆ Metal material processing: stainless steel, die steel, titanium alloy and other metal materials.
◆ Grinding liquid and pads: cooperate with diamond suspension & slurry or diamond pads manufacture.
Precision Range
Structure Diagram
Microscopic View
Order Number | Grit size micron | Median(D50) micron | Median tolerance micron | Upper limit(D99) micron |
1.01.00003 | 6.0 | 30 | 20-50 | ≤160 |